Announcements

AmBank and Huawei Malaysia Signs RM350 Million Supply Chain Financing Deal to Advance Malaysia’s Digital Infrastructure

01 December 2025

From left: U Chen Hock, Chairman of AmBank (M) Berhad, Jamie Ling, Group CEO of AmBank Group, Simon Sun, CEO of Huawei Malaysia and Maggie Yuan, Regional Director of Financing Solutions, Huawei, HQ at the signing ceremony in Shenzen, China.



 

AmBank Group has granted RM350 million Supply Chain financing facilities to Huawei Technologies (Malaysia) Sdn Bhd. The financing underscores AmBank’s commitment to supporting the nation’s long-term digital and economic aspirations. Through this collaboration, AmBank aims to:

 

  • Support the rolling out Malaysia’s second 5G network and strengthening the country’s digital infrastructure.
  • Facilitate foreign direct investment by delivering customised financial solutions that meet the needs of multinational corporations operating in Malaysia.
  • Drive national digital transformation, in alignment with Malaysia’s vision for a future-ready, technology-driven economy.

This banking relationship  highlights AmBank’s role as a trusted financial partner to global technology leaders and reaffirms the bank’s dedication to enabling strategic FDI that contributes to Malaysia’s economic growth.

Christopher Yap, Managing Director, Business Banking, AmBank Group said, “This agreement underscores our long-standing banking relationship with Huawei Malaysia and our shared vision of driving Malaysia’s digital transformation. This RM350 million supply chain financing facility demonstrates the progressive growth of our partnership with Huawei and our confidence in supporting Malaysia’s digital ambitions at scale. By deepening this collaboration, we aim to attract high-value foreign investments and accelerate the development of a resilient, future-ready digital ecosystem for the nation.”

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